M41T56C64MY6F;M41T56C64MY6E;中文规格书,Datasheet资料

September 2006 Rev 41/19

M41T56C64

Serial Real Time Clock with 56 bytes of NVRAM

+ 64 Kbit (8192 bit x 8) EEPROM

Feature summary

■5V ±10% supply voltage ■I 2C bus compatible

■Operating temperature of –40 to 85°C

■

Packaging includes:

–18-lead SOIC (with embedded crystal)■

RoHS compliant

Serial RTC features

■

Counters for seconds, minutes, hours, day, date, month, years, and century ■Embedded crystal package ■Software clock calibration

■Automatic power-fail detect and switch circuitry ■56 bytes of general purpose SRAM ■Ultra-low battery supply current of 450nA ■Automatic leap year compensation ■Special software programmable output

■

Two-wire I 2C serial interface supports 100kHz protocol

Serial EEPROM features

■

8192 bytes of general purpose EEPROM (more than 1e6 erase/write cycles)

■

Two-wire I 2C serial interface supports 400kHz protocol

■Byte and page write (up to 32 bytes)■More than 40 year data retention ■

Self-timed programming cycle

https://www.wendangku.net/doc/9b4589377.html,

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Contents

1

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1

Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.2

Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4

Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.1Serial RTC device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94.2

EEPROM device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

9Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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d u c t (s ) M41T56C64List of tables

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List of tables

Table 1.Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Table 2.Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 3.Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 4.Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Table 5.Capacitance and input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 6.DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 7.AC characteristics, (serial RTC, M41T56) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Table 8.AC characteristics (Serial EEPROM, M24C64) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 9.SOX18 – 18-lead plastic small outline, 300mils, embedded crystal, package mech.. . . . . 16Table 10.Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Table 11.

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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List of figures

Figure 1.Logic diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Figure 2.18-pin SOIC connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 3.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 4.Crystal accuracy across temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 5.AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 6.AC Bus timing requirements sequence (serial RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 7.

SOX18 – 18-lead plastic small outline, 300mils, embedded crystal. . . . . . . . . . . . . . . . . . 16

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1 Summary description

The M41T56C64 is a low power, Serial Real Time Clock with 56 bytes of NVRAM plus a

64Kb EEPROM (see Figure 3). A built-in 32,768Hz oscillator (crystal controlled) and the first 8 bytes of the RAM are used for the clock/calendar function and are configured in binary coded decimal (BCD) format. Addresses and data are transferred serially via a two-line, bi-directional bus. The built-in address register is incremented automatically after each WRITE or READ data byte.

The M41T56C64 clock has a built-in power sense circuit which detects power failures and automatically switches to the battery supply during power failures. The energy needed to sustain the RAM and clock operations can be supplied from a small lithium coin cell. Typical data retention time for the Serial RTC is in excess of 10 years with a 50mAh, 3V lithium cell. The M41T56C64 is supplied in an 18-lead Plastic SOIC package.

1.1 Calibration As the crystal is molded together with the silicon in this package, ST can program the

appropriate calibration value necessary to achieve ±5 ppm accuracy at 25°C after two SMT reflows (see Figure 4). This calibration value will be written into address 1550h of

the EEPROM. This clock accuracy can then be guaranteed to drift no more than ±3 ppm the first year, and ±1 ppm for each following year due to crystal aging.

1.Open drain output

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2 Pin settings

2.1 Pin description

2.2 Pin connections 1.No connect (NC) pins should be tied to V SS

2.No function (NF) pins should be tied to V SS. Pins 2 and 3, and pins 16 and 17 are internally shorted

together.3.Open drain output

Table 1. Signal names

FT/OUT (1)1.Open drain output

Frequency test / output driver (open drain)SDA Serial data address input / output SCL Serial clock WC

Write control

E0, E1, E2Chip enables

V BA T Battery supply voltage V CC Supply voltage V SS

Ground

NC (2)2.No connect (NC) pins should be tied to V SS .

No connect NF (3)

3.No function (NF) pins should be tied to V SS . Pins 2 and 3, and pins 16 and 17 are internally shorted

together.

No function

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M41T56C64Application 3 Application

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Application M41T56C64

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Device type identifier(1)

1.The most significant bit, b7, is sent first.

Chip enable address(2)

2.E0, E1, and E2 are compared against the respective external pins on the memory device.

RW b7b6b5b4b3b2b1b0 M24C641010E2E1E0RW M41T561101000RW

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4 Operation

4.1

Serial RTC device

The M41T56C64 contains one Serial RTC (M41T56). For detailed information on how to use the devices, see the M41T56 datasheet, which is available from your local STMicroelectronics distributor or from the STMicroelectronics website, https://www.wendangku.net/doc/9b4589377.html,/rtc/.

4.2 EEPROM device

The M41T56C64 contains a 64 Kbit Serial EEPROM (M24C64). For detailed information on

how to use the devices, see the M24C64 datasheet, which is available from your local STMicroelectronics distributor or from the STMicroelectronics website, https://www.wendangku.net/doc/9b4589377.html,/eeprom/.

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5 Maximum rating

Stressing the device above the rating listed in the “absolute maximum ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality documents.

Caution:

Negative undershoots below –0.3V are not allowed on any pin while in the battery back-up mode.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

T A

Ambient operating temperature

–40 to 85

°C

T STG

Storage temperature (V CC off, oscillator off)–55 to 125

°C

T SLD (1)1.For SOX18 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 240°C (total thermal

budget not to exceed 180°C for between 90 to 150 seconds). No direct exposure to infrared (IR) reflow, or IR preheat allowed, to avoid damaging the embedded 32KHz crystal.

Lead solder temperature for 10 seconds 240

°C V IO

Input or output voltages –0.3 to 6.5

V

V CC Supply voltage –0.3 to 6.5

V I O

Output current

20

mA P D

Power dissipation

0.25

W

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M41T56C64MY6F M41T56C64MY6E