Transistors
Rev.A 1/5
Power management (dual transistors)
UMF9N
2SC5585 and 2SK3019 are housed independently in a UMT package.
z Application
Power management circuit
z Features
1) Power switching circuit in a single package. 2) Mounting cost and area can be cut in half.
z Structure
Silicon epitaxial planar transistor
z Equivalent circuits
z Packaging specifications
UMF9N UMT6F9TR 3000
Type Package Marking Code
Basic ordering unit (pieces)
z Dimensions (Units : mm)
Transistors
Rev.A 2/5
z Absolute maximum ratings (T a=25°C) Tr1
Parameter
Symbol
V CBO
V CEO V EBO I C I CP
P C Tj Tstg Limits 15126500
150(TOTAL)150?55 to +1501.0?1?2
Unit V V V mA A mW °C °C
Collector-base voltage Collector-emitter voltage Emitter-base voltage
Collector current
Power dissipation
Junction temperature
Range of storage temperature ?1 Single pulse P W =1ms
?2 120mW per element must not be exceeded. Each terminal mounted on a recommended land.
Tr2
Parameter
?1 P W ≤10ms Duty cycle ≤50%
?2 120mW per element must not be exceeded. Each terminal mounted on a recommended land.Symbol V DSS V GSS I D I DRP P D
Tch Tstg Limits 30±20100200150(TOTAL)150?55 to +150?1?1?2
Unit
V V mA I DP 200mA mA I DR 100mA mW °C °C
Drain-source voltage
Gate-source voltage
Drain current
Reverse drain
current Total power dissipation Channel temperature
Range of storage temperature Continuous
Continuous Pulsed
Pulsed
z Electrical characteristics (T a=25°C) Tr1
Parameter
Symbol Min.Typ.Max.Unit Conditions
V CB =10V, I E =0mA, f =1MHz
Transition frequency
f T ?320?MHz V CE =2V, I E =?10mA, f =100MHz BV CEO 12??V I C =1mA Collector-emitter breakdown voltage BV CBO 15??V I C =10μA Collector-base breakdown voltage BV EBO 6??V I E =10μA Emitter-base breakdown voltage I CBO ??100nA V CB =15V Collector cut-off current I EBO ??100nA V EB =6V
Emitter cut-off current
V CE(sat)?100250mV I C =200mA, I B =10mA Collector-emitter saturation voltage h FE 270?680?V CE =2V, I C =10mA
DC current gain
Cob ?7.5?pF
Collector output capacitance
Transistors
Rev.A 3/5
z
Electrical characteristic curves Tr1
Fig.1 Grounded emitter propagation
characteristics
BASE TO EMITTER VOLTAGE : V BE (V)
C O L L E C T O R C U R R E N T : I C (m A )
COLLECTOR CURRENT : I C (mA)Fig.2 DC current gain vs.
collector current D C C U R R E N T G A I N : h F E
Fig.3 Collector-emitter saturation voltage
vs. collector current ( Ι )
COLLECTOR CURRENT : I C (mA)
C O L L E C T O R S A T U R A T I O N V O L T A G E : V C E (s a t ) (m V )
Fig.4 Collector-emitter saturation voltage
vs. collector current ( ΙΙ
)
COLLECTOR CURRENT : I C (mA)
C O L L E C T O R S A T U R A T I O N V O L T A G E : V C E (s a t ) (m V )
COLLECTOR CURRENT : I C (mA)Fig.5 Base-emitter saturation voltage
vs. collector current B A S E R S A T U R A T I O N V O L T A G E : V B E (s a t ) (m V )
Fig.6 Gain bandwidth product
vs. emitter current
EMITTER CURRENT : I E (mA)
1
T R A N S I T I O N F R E Q U E N C Y : f T (M H z )
10
1000
100
Fig.7 Collector output capacitance
vs. collector-base voltage Emitter input capacitance vs. emitter-base voltage
110
100
1000
C O L L E C T O R O U T P U T C A P A C I T A N C E : C o b (p F )
E
M I T T E R I N P U T C A P A C I T A N C E : C i b (p F )EMITTER TO BASE VOLTAGE : V EB (V)
EMITTER CURRENT : V CE (V)
Fig.8 Safe operation area
0.001T R A N S I T I O N F R E Q U E N C Y : I C (A )
0.01
10
0.1
1
Transistors
Rev.A 4/5
Tr2
D R A I N C U R R
E N T : I D (A )
GATE-SOURCE VOLTAGE : V GS (V)
Fig.9 Typical transfer characteristics
G A T E T H R E S H O L D V O L T A G E : V G S (t h ) (V )
CHANNEL TEMPERATURE : Tch (°C)Fig.10 Gate threshold voltage vs.
channel temperature
S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (?)
DRAIN CURRENT : I D (A)
Fig.11 Static drain-source on-state
resistance vs. drain current ( Ι )
S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (?)
DRAIN CURRENT : I D (A)Fig.12 Static drain-source on-state
resistance vs. drain current ( ΙΙ )
GATE-SOURCE VOLTAGE : V GS (V)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (?)
Fig.13 Static drain-source on-state
resistance vs. gate-source voltage
CHANNEL TEMPERATURE : Tch (°C)
S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (?)
Fig.14 Static drain-source on-state
resistance vs. channel temperature
F O R W A R D T R A N S F E R A D M I T T A N C E : |Y f s | (S )
DRAIN CURRENT : I D (A)
Fig.15 Forward transfer admittance vs.
drain current
R E V E R S E D R A I N C U R R E N T : I D R (A )
SOURCE-DRAIN VOLTAGE : V SD (V)
Fig.16 Reverse drain current vs.
source-drain voltage ( Ι )
R E V E R S E D R A I N C U R R E N T : I D R (A )
SOURCE-DRAIN VOLTAGE : V SD (V)
Fig.17 Reverse drain current vs.
source-drain voltage ( ΙΙ )
Transistors
Rev.A 5/5
C A P A C I T A N C E : C (p F )
DRAIN-SOURCE VOLTAGE : V DS (V)Fig.18 Typical capacitance vs.
drain-source voltage
S W I T H I N G T I M E : t (n s )
DRAIN CURRENT : I D (mA)
Fig.19 Switching characteristics
Appendix1-Rev2.0
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Appendix
分销商库存信息: ROHM
UMF9NTR