SM15T39CA中文资料

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TRANSIL TM

s

PEAK PULSE POWER :1500W (10/1000μs)s

BREAKDOWN VOLTAGE RANGE :From 6.8V to 220V

s

UNI AND BIDIRECTIONAL TYPES s

LOW CLAMPING FACTOR s

FAST RESPONSE TIME s

UL RECOGNIZED

FEATURES

Symbol Parameter

Value Unit P PP Peak pulse power dissipation (see note1)Tj initial =T amb 1500W P Power dissipation on infinite heatsink T amb =50°C 6.5W I FSM Non repetitive surge peak forward current for unidirectional types tp =10ms

Tj initial =T amb

200

A

T stg T j Storage temperature range Maximum junction temperature

-65to +175

150

°C °C T L

Maximum lead temperature for soldering during 10s.

260

°C

Note 1:For a surge greater than the maximum values,the diode will fail in short-circuit.

ABSOLUTE MAXIMUM RATINGS (T amb =25°C)DESCRIPTION

Transil diodes provide high overvoltage protection by clamping action.Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s.

September 2001Ed :3B Symbol Parameter

Value Unit R th (j-l)Junction to leads

15°C/W R th (j-a)

Junction to ambient on printed circuit on recommended pad layout

75

°C/W

THERMAL RESISTANCES

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Symbol Parameter

V RM Stand-off voltage V BR Breakdown voltage V CL Clamping voltage I RM Leakage current @V RM I PP

Peak pulse current

αT

Voltage temperature coefficient V F

Forward Voltage drop

ELECTRICAL CHARACTERISTICS (T amb =25°C)

Types

I RM @V RM V BR @I R V CL @I PP V CL @I PP αT C

max

min

nom max max

max max typ note2

10/1000μs

8/20μs

note3note4

Uni directional Mar-king Bi directional Mar-king μA V V V V mA V A V A 10-4/°C pF SM15T6V8A MDE SM15T6V8CA BDE 1000 5.8 6.45 6.87.141010.514313.4746 5.79500SM15T7V5A MDG SM15T7V5CA BDG

500

6.4

7.137.57.881011.313214.5690 6.18500SM15T10A MDP SM15T10CA BDP 108.559.51010.5114.510318.65387.37000SM15T12A MDT SM15T12CA BDT 510.211.41212.6116.79021.7

4617.86000SM15T15A MDX SM15T15CA BDX 112.814.31515.8121.27127.23688.45000SM15T18A MEE SM15T18CA BEE 115.317.11818.9125.259.532.53088.84300SM15T22A MEK SM15T22CA BEK 118.820.92223.1130.64939.32549.23700SM15T24A MEM SM15T24CA BEM 120.522.82425.2133.24542.82349.43500SM15T27A MEP SM15T27CA BEP 123.125.72728.4137.54048.32079.63200SM15T30A MER SM15T30CA BER 125.628.53031.5141.53653.51879.72900SM15T33A MET SM15T33CA BET 128.231.43334.7145.73359.01699.82700SM15T36A MEV SM15T36CA BEV 130.834.23637.8149.93064.31569.92500SM15T39A MEX SM15T39CA BEX 133.337.13941.0153.92869.714310.02400SM15T68A MFP SM15T68CA BFP 158.164.66871.419216.31218310.41550SM15T75A

MFO

SM15T75CA BFO 164.171.3-78.8110314.61347510.51450SM15T100A MFX SM15T100CA BFX 185.595.01001051137111785610.61150SM15T150A MGK SM15T150CA BGK 112814315015812077.22653810.8850SM15T200A MGV SM15T200CA

BGV

1171

190

200

210

1

274

5.5

353

28

10.8

675

SM15T220A MGX

SM15T220CA BGX 11882092202311328 4.63882610.8625

Note 2:Pulse test:tp <50ms.

Note 3:?V BR =αT *(T amb -25)*V BR (25°C).

Note 4:

V R =0V,F =1MHz.For bidirectional types,capacitance value is divided by 2.

Fig.1:Peak pulse power dissipation versus initial junction temperature (printed circuit board).

s

%I PP 50

t

100

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Fig.2:Peak pulse power versus exponential pulse

duration.

Fig.3:

Clamping voltage versus peak pulse current.Exponential waveform t p =20μs

t p =1ms ——————-t p =10ms ...............

Note :The curves of the figure 3are specified for a junction temperature of 25?C before surge.

The given results may be extrapolated for other junction temperatures by using the following formula :?V BR =αT *[T amb -25]*V BR (25°C).

For intermediate voltages,extrapolate the given results.

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Fig.6:Transient thermal impedance junc-tion-ambient versus pulse duration.

Mounting on FR4PC Board with recommended pad

layout.

Fig.5:Peak forward voltage drop versus peak forward current (typical values for unidirectional types).

Fig.4b :Capacitance versus reverse applied voltage for bidirectional types (typical values).

Fig.4a :Capacitance versus reverse applied voltage for unidirectional types (typical

values).

Fig.7:Relative variation of leakage current versus junction temperature.

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Packaging :standard packaging is in tape and reel.

PACKAGE MECHANICAL DATA SMC (Plastic)

ORDER CODE

Weight =0.25g.

MARKING :Logo,Date Code,Type Code,Cathode Band (for unidirectional types only).FOOTPRINT DIMENSIONS (Millimeters)SMC

REF.DIMENSIONS

Millimeters Inches Min.

Max.Min.Max.A1 1.90 2.450.0750.096A20.050.200.0020.008b 2.90 3.20.1140.126c 0.150.410.0060.016E

7.758.150.3050.321E1 6.607.150.2600.281E2

4.40 4.700.1730.185D

5.55

6.250.2180.246L

0.75

1.60

0.030

0.063

Information furnished is believed to be accurate and reliable.However,STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics.Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-proval of STMicroelectronics.

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