5962-89845022A中文资料

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

5962-89845022A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8984502CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8984502DA ACTIVE CFP W141TBD A42N/A for Pkg Type 5962-8984502VCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8984502VDA ACTIVE CFP W141TBD A42N/A for Pkg Type SN54HC132J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN74HC132D ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DBLE OBSOLETE SSOP DB14TBD Call TI Call TI

SN74HC132DBR ACTIVE SSOP DB142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DBRE4ACTIVE SSOP DB142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DE4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DG4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DR ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DRE4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DRG4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DT ACTIVE SOIC D14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132DTE4ACTIVE SOIC D14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132N ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SN74HC132NE4ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SN74HC132NSR ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132NSRE4ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132PW ACTIVE TSSOP PW1490Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132PWE4ACTIVE TSSOP PW1490Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74HC132PWLE OBSOLETE TSSOP PW14TBD Call TI Call TI

SN74HC132PWR ACTIVE TSSOP PW142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132PWRE4ACTIVE TSSOP PW142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132PWT ACTIVE TSSOP PW14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC132PWTE4ACTIVE TSSOP PW14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

SNJ54HC132FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54HC132J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ54HC132W ACTIVE CFP W141TBD A42N/A for Pkg Type SNV54HC132J ACTIVE CDIP J14TBD Call TI Call TI

SNV54HC132W ACTIVE CFP W14TBD Call TI Call TI

(1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/c71331534.html,/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

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