MDS752中文资料

ZMD-Standard

March 1998

Package

SOP16

(150 mil)

MDS

752

Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.03.1998Doc-No.

QS-000752-HD-01

Check: signed Marx

Quality: signed Lorenz

Dimensions in millimetres

Based on IEC 191-2Q: Type 076E07S 1Dimensions

Dimensions of Sub-Group B1Dimensions of Sub-Group C1A max 1,73A min 1,55b Pmin 0,35A 1min 0,127b Pmax 0,49A 1max 0,25e nom 1,27A 2min 1,40H Emin 5,80A 2max 1,55H Emax 6,30c min 0,19L Pmin 0,40c max 0,25Z max

0,55

D min *9,80D max *9,982Weight

￡ 0,5 g

E min *3,803Package Body Material Low Stress Epoxy E max *4,004Lead Material FeNi-Alloy or Cu-Alloy k min 0,255Lead Finish solder plating q min 0°6Lead Form

Z-bends

q max

8°

* without mold-flash

X

E

D

H E

1

16

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