73659-0003中文资料

J-38MX01 B a c k p l a n e C o n n e c t o r S y s t e m s J

FEATURES AND SPECIFICATIONS

2.00mm (.079") Pitch HDM*Board-to-Board Backplane Power Module 73656/73659Vertical Power Receptacle

Features and Bene?ts

s 15A per blade current carrying capacity

s Press-?t on backplane eliminates soldering

s Female on backplane for safety

s 12mm module can be distributed between signal modules

as needed

s Metric connector in Futurebus form factor

s Surface Mount Compatible

Reference Information

Product Speci?cation: PS-73651-1998

Packaging: Tube

Electrical Current: 15.0A Dielectric Withstanding Voltage: 1000V Insulation Resistance: 1000 M ? min. Mechanical Insertion Force: 135N max. per press-fit pin Retention Force: 22.5N min. per press-fit pin Mating Force: 2.5N max. per contact Unmating Force: 0.15N min.Normal Force: 1.0N min.Durability: 250 cycles 0.71.028

DIA plated thru hole TYP 0.8380.0330

DIA drilled hole Note: Press-fit version shown

ORDERING INFORMATION

* High Density Metric and HDM PLUS are trademarks of Teradyne, Inc.

Module

Order No.Termination Tail Length Backplane Power Module

73656-0000Press-Fit 3.50(.138)Midplane Power Module

73659-0001Solder Tail 2.00(.079)Midplane Power Module

73659-0002Solder Tail 2.50(.098)Midplane Power Module

73659-0003Solder Tail 3.00(.118)Midplane Power Module 73659-0004Solder Tail 3.50(.138)元器件交易网https://www.wendangku.net/doc/ff1241316.html,