1.Electrical Specification
Remark : Bandwidth & Peak Gain was measured under evaluation board of page2 Part Number Information
WAN 3216 F 157 C 0X(X=3~5)
A B C D E F
2.Recommended PCB Pattern
◆Evaluation Board Dimension
◆Suggested Matching Circuit
永昀科技股份有限公司WinWave Electronic Co., Ltd.
9F-2, No.82, Sec. 3, Beisin Rd., Sindian District, New Taipei City 23143, Taiwan(R.O.C.)
Layout Dimensions in Clearance area ( Size=4.40*5.0mm)
Circuit
3.Measurement Results
Return Loss
Radiation Pattern
Chamber Coordinate System
Y
Z
4. Reliability and Test Condictions
1. No visible mechanical damage
1. No visible mechanical damage
5. Soldering and Mounting
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in
coefficients of expansion between solder, chip and substrate. The
terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be
employed the following precautions are recommended.
?Preheat circuit and products to 150℃
?Never contact the ceramic with the iron tip
?Use a 20 watt soldering iron with tip diameter of 1.0mm
?280℃ tip temperature (max)
?1.0mm tip diameter (max)
?Limit soldering time to 3 sec.
6. Packaging Information
◆Tape Specification:
◆Reel Specification: (7’’, Φ180 mm)
7. Storage and Transportation Information
◆Storage Conditions
To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH.
2. Recommended products should be used within 6 months from the time
of delivery.
3. The packaging material should be kept where no chlorine or sulfur
exists in the air.
◆Transportation Conditions
1. Products should be handled with care to avoid damage or
contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for
individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are
minimized.
8. Revision Table