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PS2913-1中文资料

PS2913-1中文资料
PS2913-1中文资料

PS2913-1

NEC's SINGLE TR. OUTPUT,

HIGH COLLECTOR-EMITTER VOLTAGE,

4-PIN ULTRA SMALL FLAT LEAD

OPTOCOUPLER

FEATURES

?ULTRA SMALL FLAT LEAD PACKAGE:4.6 (L) x 2.5 (W) x 2.1 (H) mm ?ISOLATION DISTANCE:0.4 mm MIN

?HIGH COLLECTOR TO EMITTER VOLTAGE:V CEO = 120 V ?HIGH ISOLATION VOLTAGE BV = 2500 Vr.m.s.?AVAILABLE IN TAPE AND REEL:PS2913-1-F3, F4: 3500 pcs/reel

PART NUMBER

PS2913-1SYMBOLS

PARAMETERS

UNITS MIN TYP MAX V F Forward Voltage, I F = 1 mA V 0.9

1.1

1.3I R Reverse Current, V R = 5 V

μA 5

C T Terminal Capacitance, V = 0, f = 1.0 MHz

pF 15

I CEO Collector to Emitter Dark Current, I F = 1 mA, V CE = 120 V nA 100CTR Current Transfer Ratio (I C /I F ), I F = 1 mA, V CE = 5 V %50

100200V CE(sat)

Collector Saturation Voltage, I F

= 1 mA, I C = 0.2 mA V 0.130.3

R I-O Isolation Resistance, V

I-O = 1.0 kV DC ?1011

C I-O Isolation Capacitance, V = 0 V, f = 1.0 MHz pF 0.4tr Rise Time 1V CC = 5 V, I C = 2 mA, R L = 100 ?

μs 10tf Fall Time 1μs 10t ON On Time 1V CC = 5 V, I F = 1 mA, R L = 5 k ?μs 80t S Storage Time 1μs 5t F

Off Time 1

μs

50

ELECTRICAL CHARACTERISTICS (T A = 25°C)

T r a n s i s t o r D i o d e

C o u p l e d California Eastern Laboratories

Note:

1.Test Circuit for Switching Time

DESCRIPTION

NEC's PS2913-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor is one package for high density mounting applications. This device is housed in an ultra small flat-lead package which realizes a reduction in mounting area of about 30% compared with the PS28XX series.

APPLICATIONS

? HYBRID IC

? POWER SUPPLY

V CC

or 5 k ?

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OUTLINE DIMENSIONS (Units in mm)

TOP VIEW

MARKING

N 13

111

–Last number of Type No: 13–An initial of "NEC"

–Assembly lot

(nicked corner)

111

Week assembled Year assembled

PS2913-1

.

SYMBOLS PARAMETERS UNITS RATINGS

Diode I F Forward Current (DC)mA 50?I F /°C Forward Current Derating mA/°C 0.5I F (Peak)Peak Forward Current 2A 0.5P D Power Dissipation mW 60V R

Reverse Voltage

V

6Transistor V CEO

Collector to Emitter Voltage V 120V ECO Emitter to Collector Voltage V 6

I C

Collector Current

mA 30?P C /?C Power Dissipation Derating mW/?C 1.2P C Power Dissipation mW 120Coupled V ISO Isolation Voltage 3

V r.m.s.2500P T Total Power Dissipation mW 160

T A Operating Ambient Temp.°C -55 to +100T STG

Storage Temperature

°C

-55 to +150

ABSOLUTE MAXIMUM RATINGS 1 (T A = 25°C)

Notes:

1.Operation in excess of any one of these parameters may result in permanent damage.

2.PW = 100 μs, Duty Cycle = 1%.

3.AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output.

2

( ): Reference value

RECOMMENDED MOUNT PAD DIMENSIONS (Units in mm)

Remark:

This drawing is considered to meet air and outer creepage distance 4.0 minimum. All dimensions in this figure must be evaluated before use.

1. Anode

2. Cathode

3. Emitter

4. Collector

OPTOCOUPLER CONSTRUCTION

PARAMETER UNITS (MIN)

Air Distance 4 mm Creepage Distance 4 mm Isolation Distance

0.4 mm

PART NUMBER PACKING STYLE

PS2913-1-F3Embossed Tape 3500 pcs/reel

PS2913-1-F4

ORDERING INFORMATION

CAUTIONS REGARDING NOISE:

Be aware that when voltage is applied suddenly between the optocoupler's input and outout or between collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.

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TYPICAL CHARACTERISTICS (T A = 25°C, unless otherwise specified)

10

1

0.10.0

0.20.40.60.8 1.0

80

60

40

20

025*******

0.5 mA/°C

0255075100120

120140

100806040

20

100

10

1

0.1

0.01

0.0

0.5 1.0 1.5 2.0

12

10

8

6

4

2

0246810

5000010000500010005001005010510.50.1M a x i m u m F o r w a r d C u r r e n t , I F (m A )

Ambient Temperature, T A (°C)Ambient Temperature, T A (°C)

T r a n s i s t o r P o w e r D i s s i p a t i o n , P C (m W )

Forward Voltage, V F (V)

F o r w a r d C u r r e n t , I F (m A )

C o l l e c t o r C u r r e n t , I C (V )

Collector to Emitter Voltage, V CE (V)

CollectorSaturation Voltage, V CE(sat) (V)

C o l l e c t o r C u r r e n t , I C (m A )

Ambient Temperature, T A (°C)C o l l e c t o r t o E m i t t e r D a r k C u r r e n t , I C E O (n A )

MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE

TRANSISTOR POWER DISSIPATION

vs. AMBIENT TEMPERATURE

FORWARD CURRENTvs.FORWARD VOLTAGE

COLLECTOR CURRENTvs.

COLLECTOR TO EMITTER VOLTAGE

COLLECTOR TO EMITTER DARK CURRENT

vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

PS2913-1

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TYPICAL CHARACTERISTICS (T A = 25°C, unless otherwise specified)

Normalized to 1.0at T A = 25°C,

I F = 1 mA, V CE = 5 V

1.41.21.0

0.8

0.60.40.20.0-50

-25

25

50

75

100

10000

1000

100

10

11.2

1.0

0.8

0.6

0.4

0.2

0.0

6

Time (Hr)

C T R (r e l a t i v e V a l u e )

Load Resistance, R L (?)S w i t c h i n g T i m e , t (μs )

N o r m a l i z e d G a i n , G V

Frequency, f (kHz)

Forward Current, I F (mA)

C u r r e n t T r a n s f e r R a t i o , C T R (%)

Ambient Temperature, T A (°C)N o r m a l i z e d C u r r e n t

T r a n s f e r R a t i o , C T R

NORMALIZED CURRENT TRANSFER RATIO

vs. AMBIENT TEMPERATURE

CURRENT TRANSFER RATIO vs. FORWARD CURRENT

SWITCHING TIME vs. LOAD RESISTANCE

FREQUENCY RESPONSE

LONG TERM CTR DEGRADATION

PS2913-1

300

250

200

150

100

50

0REMARK: The graphs indicate nominal characteristics.

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TAPING SPECIFICATIONS (Units in mm)

flange

PS2913-1

Packing: 3500 pcs/reel

TAPE OUTLINE AND DIMENSIONS

TAPE DIRECTION

REEL OUTLINE AND DIMENSIONS

N N N N

N N N N

PS2913-1-F3PS2913-1-F3

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RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering ?Peak reflow temperature 260 ?C or below (package surface temperature)?Time of peak reflow temperature 10 seconds or less ?Time of temperature higher than 220 ?C 60 seconds or less ?Time to preheat temperature from 120 to 180°C 120±30 s ?Number of reflows Three

?Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended).

(2) Wave soldering ?Temperature 260 ?C or below (molten solder temperature)?Time

10 seconds or less

?Preheating conditions 120°C or below (package surface temperature)

?Number of times One (Allowed to be dipped in solder including plastic mold portion.)?Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is recommended).

(3) Cautions ? Fluxes

Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature ad high humidity.

PS2913-1

Time (s)

P a c k a g e S u r f a c e T e m p e r a t u r e T (?C )

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

10/14/2003

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.

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